Abstract
The solid state reactions between copper and aluminum were studied In the temperature region 370-520°C. The rate of growth of the different intermetallic layers has been measured as a function of time and temperature.
| Original language | French |
|---|---|
| Publisher | SCK CEN |
| Number of pages | 9 |
| State | Published - Mar 1962 |
Publication series
| Name | SCK•CEN Reports |
|---|---|
| Publisher | Studiecentrum voor Kernenergie |
| No. | BLG-179 |
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