A ∑=27 coincidence grain boundary in a Cu-Ni alloy

Th Karakostas; G. L. Bleris; J. G. Antonopoulos; P. Delavignette

doi:10.1007/BF01203506

A ∑=27 coincidence grain boundary in a Cu-Ni alloy

Th Karakostas, G. L. Bleris, J. G. Antonopoulos, P. Delavignette

Research output › peer-review

Abstract

A systematic method has been used to characterize a particular grain boundary in a Cu-Ni alloy. Its multiplicity is ∑=27 a and a deviation from that orientation has been calculated and expressed by a small-angle rotation matrix. The deviation angle of 50′ has been calculated by electron diffraction patterns and also on the basis of the intrinsic dislocation structure. These have been found to be of the same type as the matrix dislocations, having also a relation to the ∑=27 6a orientation relationship.

Original language	English
Pages (from-to)	3361-3370
Number of pages	10
Journal	Journal of Materials Science
Volume	17
Issue number	11
DOIs	https://doi.org/10.1007/BF01203506
State	Published - Nov 1982
Externally published	Yes

ASJC Scopus subject areas

Ceramics and Composites
Materials Science (miscellaneous)
General Materials Science
Mechanics of Materials
Mechanical Engineering
Polymers and Plastics

Access to Document

10.1007/BF01203506

Cite this

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