Grain boundary analysis in TEM. IV. Coincidence and the associated defect structure in tungsten carbide

S. Hagége; G. Nouet; P. Delavignette

doi:10.1002/pssa.2210620110

Grain boundary analysis in TEM. IV. Coincidence and the associated defect structure in tungsten carbide

S. Hagége, G. Nouet, P. Delavignette

Research output › peer-review

Abstract

A numerical method is used to obtain a list of exact coincidences for the particular hexagonal system (c/a = 1). The carbide‐carbide interfaces in WC‐Co composites are examined using TEM. A Σ= 2 related coincidence boundary is observed and described analytically in terms of a supplementary twist component. The defect structure is analysed using the planar matching model.

Original language	English
Pages (from-to)	97-107
Number of pages	11
Journal	physica status solidi (a)
Volume	62
Issue number	1
DOIs	https://doi.org/10.1002/pssa.2210620110
State	Published - 16 Nov 1980
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics

Access to Document

10.1002/pssa.2210620110

Cite this

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title = "Grain boundary analysis in TEM. IV. Coincidence and the associated defect structure in tungsten carbide",

abstract = "A numerical method is used to obtain a list of exact coincidences for the particular hexagonal system (c/a = 1). The carbide‐carbide interfaces in WC‐Co composites are examined using TEM. A Σ= 2 related coincidence boundary is observed and described analytically in terms of a supplementary twist component. The defect structure is analysed using the planar matching model.",

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AB - A numerical method is used to obtain a list of exact coincidences for the particular hexagonal system (c/a = 1). The carbide‐carbide interfaces in WC‐Co composites are examined using TEM. A Σ= 2 related coincidence boundary is observed and described analytically in terms of a supplementary twist component. The defect structure is analysed using the planar matching model.

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