Grain boundary mediated plasticity: The role of grain boundary atomic structure and thermal activation

Dmitry Terentyev, Alexander Bakaev, A. Serra, F. Pavia, K.L. Baker, N. Anento

    Research outputpeer-review


    The interaction of dislocation pile-ups with several tilt grain boundaries (GB) is studied in copper by using a hybrid continuum-atomistic approach. The effects of temperature, pile-up intensity and GB structure on absorption and transmission of slip as a function of local stress state are explored. By considering several high-angle GBswith different misorientation angles, we demonstrate that GB atomic structure primarily defines its ability to accommodate incoming pile-up dislocations, thus limiting the direct transmission of pile-ups through the interface.
    Original languageEnglish
    JournalScripta Materialia
    Issue number1-4
    StatePublished - 4 Oct 2017

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