Transmission electron microscopy of intergranular regions of corroded silicon nitride

A. D. Stalios; J. Luyten; F. L. Riley; R. J. Fordham

doi:10.1016/0955-2219(95)00018-P

Transmission electron microscopy of intergranular regions of corroded silicon nitride

A. D. Stalios, J. Luyten, F. L. Riley, R. J. Fordham

Research output › peer-review

Abstract

Two hot-pressed, dense, silicon nitride materials have been exposed to the flue gases of an aluminium smelting furnace heavily contaminated with Al, Ca and K-containing dust and vapours. Transmission electron microscopy (TEM) has been used to examine microstructural changes occurring in the silicon nitride at the interface between corroded and uncorroded material. Extensive diffusion of contaminant metal into the intergranular glass of the silicon nitride occurs, associated with physical and chemical changes in the intergranular regions, and a marked loss of mechanical strength.

Original language	English
Pages (from-to)	573-579
Number of pages	7
Journal	Journal of the European Ceramic Society
Volume	15
Issue number	6
DOIs	https://doi.org/10.1016/0955-2219(95)00018-P
State	Published - 1995
Externally published	Yes

Funding

This work has beenp artly supportedb y the Commission of the European Communities through StimulationA ction Contract ST2J-0146-UK(CD).

Funders	Funder number
Not added	ST2J-0146-UK

ASJC Scopus subject areas

Ceramics and Composites
Materials Chemistry

Access to Document

10.1016/0955-2219(95)00018-P

Cite this

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title = "Transmission electron microscopy of intergranular regions of corroded silicon nitride",

abstract = "Two hot-pressed, dense, silicon nitride materials have been exposed to the flue gases of an aluminium smelting furnace heavily contaminated with Al, Ca and K-containing dust and vapours. Transmission electron microscopy (TEM) has been used to examine microstructural changes occurring in the silicon nitride at the interface between corroded and uncorroded material. Extensive diffusion of contaminant metal into the intergranular glass of the silicon nitride occurs, associated with physical and chemical changes in the intergranular regions, and a marked loss of mechanical strength.",

author = "Stalios, {A. D.} and J. Luyten and Riley, {F. L.} and Fordham, {R. J.}",

year = "1995",

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AU - Stalios, A. D.

AU - Luyten, J.

AU - Riley, F. L.

AU - Fordham, R. J.

PY - 1995

Y1 - 1995

N2 - Two hot-pressed, dense, silicon nitride materials have been exposed to the flue gases of an aluminium smelting furnace heavily contaminated with Al, Ca and K-containing dust and vapours. Transmission electron microscopy (TEM) has been used to examine microstructural changes occurring in the silicon nitride at the interface between corroded and uncorroded material. Extensive diffusion of contaminant metal into the intergranular glass of the silicon nitride occurs, associated with physical and chemical changes in the intergranular regions, and a marked loss of mechanical strength.

AB - Two hot-pressed, dense, silicon nitride materials have been exposed to the flue gases of an aluminium smelting furnace heavily contaminated with Al, Ca and K-containing dust and vapours. Transmission electron microscopy (TEM) has been used to examine microstructural changes occurring in the silicon nitride at the interface between corroded and uncorroded material. Extensive diffusion of contaminant metal into the intergranular glass of the silicon nitride occurs, associated with physical and chemical changes in the intergranular regions, and a marked loss of mechanical strength.

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